• DEBORN

Methylhexahydrophthalic anhydride (MHHPA)

Epoxy resin curing agents thiab lwm yam.

MHHPA yog ib qho thermo-setting epoxy resin curing tus neeg sawv cev tsuas yog siv hauv hluav taws xob thiab hluav taws xob.


  • Xim / Hazen:≤ 20
  • Cov ntsiab lus,%:9 9,0mn
  • Lodine Tus Nqi:≤1.0
  • CAS Nr:.25550-51-0
  • Product Detail

    Khoom cim npe

    Taw qhia
    Methylhexahydrophthalic anhydride, MHHPA
    CAS Nr .: 25550-51-0

    Khoom Specification

    Cov tsos mob Colorless kua
    Xim / Hazen ≤ 20
    Cov ntsiab lus,% 9 9,0mn.
    Tus nqi iodine ≤1.0
    viscosity (25 ℃) 40mPa•s Min 
    Dawb Acid ≤ 1.0%
    Txias Point ≤-15 ℃
    Cov qauv qauv C9H12O3

    Cov yam ntxwv ntawm lub cev thiab tshuaj lom neeg

    Lub cev lub cev (25 ℃) Ua kua
    Qhov tshwm sim Cov kua dej tsis muaj xim
    Molecular Luj 168.19 Nws
    Lub ntiajteb txawj nqus tshwj xeeb (25/4 ℃) 1.162 ib
    Dej Solubility decomposes
    Solvent Solubility Soluble me ntsis: roj av ether Miscible: benzene, toluene, acetone, carbon tetrachloride, chloroform, ethanol, ethyl acetate

    Daim ntawv thov
    Epoxy resin curing agents thiab lwm yam.
    MHHPA yog ib qho thermo-setting epoxy resin curing tus neeg sawv cev tsuas yog siv hauv hluav taws xob thiab hluav taws xob.Nrog rau ntau yam zoo, piv txwv li, tsis tshua muaj melting point, tsis tshua muaj viscosity ntawm cov mixs nrog salicylic epoxy resins, siv sij hawm ntev, siab kub-tiv taus ntawm cov khoom kho thiab zoo heev hluav taws xob khoom ntawm kub kub, MHHPA yog dav siv rau impregnating hluav taws xob coils, casting. cov khoom siv hluav taws xob thiab sealing semiconductors, xws li sab nraum zoov insulators, capacitors, lub teeb emitting diodes thiab cov zaub.

    Ntim
    Ntim hauv 25 kg yas nruas los yog 220kg hlau nruas isotank.

    Cia
    Khaws rau hauv qhov chaw txias, qhuav thiab kom deb ntawm hluav taws thiab noo noo.


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  • Sau koj cov lus ntawm no thiab xa tuaj rau peb